MediaTek is reportedly putting its upcoming Dimensity 8500 chip through rigorous testing, with expectations for an imminent launch. This new SoC is poised to be the direct successor to the Dimensity 8400, promising enhanced performance and efficiency. Whispers suggest that a yet-to-be-named Honor smartphone, possibly boasting a massive 10,000mAh battery, along with the anticipated Xiaomi 17T, could feature this powerful new chipset. A recent leak from a prominent tipster has shed light on the Dimensity 8500’s architecture, die size, and impressive peak clock speed.
Dimensity 8500: Powering Next-Gen Mid-Range Devices with TSMC’s 4nm Process
Digital Chat Station, a reliable source on Chinese microblogging platforms, recently divulged crucial details about the rumored MediaTek Dimensity 8500 chipset. According to the leak, the SoC is expected to be fabricated using TSMC’s cutting-edge 4nm process technology, a significant advancement for mid-range devices. The chip is rumored to house an octa-core CPU, featuring Cortex-A725 cores. During its current testing phase, a prototype of the Dimensity 8500 reportedly achieved a peak clock speed of 3.4GHz, indicating substantial processing power.
Further details from the tipster suggest the MediaTek Dimensity 8500 chipset will be complemented by an upgraded Mali-G720 GPU, clocked at an impressive 1.5GHz. Benchmark results shared by the tipster paint a promising picture of its performance capabilities, with the chip reportedly scoring over 2.2 million points on AnTuTu. Intriguingly, the Dimensity 8500 is said to even outclass the Snapdragon 8 Gen 3 and Snapdragon 8s Gen 4 in terms of GPU performance, positioning it as a formidable contender for next-generation mid-range smartphones.
Earlier this month, reports hinted that the upcoming Xiaomi 17T and Xiaomi 17T Pro, codenamed ‘chagall’ and ‘warhol’ respectively, might be powered by the MediaTek Dimensity 8400 and Dimensity 9500 chipsets. These two handsets are projected to launch in February 2026. Additionally, an Honor device, potentially marketed as the Honor Power 2, is also expected to incorporate this new chipset, paired with an exceptionally large 10,000mAh battery.
It’s important to note that MediaTek has yet to officially confirm the launch of any new chip in the Dimensity 8000-series. However, the company did unveil its flagship 3nm octa-core Dimensity 9500 SoC in September, which boasts a peak clock speed of 4.21GHz and supports UFS 4.1 storage. This high-end chip is already featured in recent flagship smartphones, including the Vivo X300 series and Oppo X9 lineup.